HSB14-353518

CUI Devices

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HSB14-353518

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HEAT SINK, BGA, 35 X 35 X 18 MM

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Mfr	CUI Devices
Type	Top Mount
Shape	Square, Pin Fins
Width	1.378" (35.00mm)
Length	1.378" (35.00mm)
Series	HSB
Package	Box
Diameter	-
Material	Aluminum Alloy
Fin Height	0.709" (18.00mm)
Package Cooled	BGA
Product Status	Active
Material Finish	Black Anodized
Attachment Method	Adhesive
Thermal Resistance @ Natural	8.97°C/W
Power Dissipation @ Temperature Rise	8.4W @ 75°C
Thermal Resistance @ Forced Air Flow	3.60°C/W @ 200 LFM