HSE-B635-045H

CUI Devices

Product No:

HSE-B635-045H

Manufacturer:

Package:

Batch:

Datasheet:

Description:

HEAT SINK, EXTRUSION, TO-220, 63

Quantity:

Delivery:

Payment:

In Stock : Please Inquiry

Please send RFQ , we will respond immediately.

Contact Name

Company name

Country

Quantity

Mfr	CUI Devices
Type	Board Level, Vertical
Shape	Rectangular, Angled Fins
Width	1.772" (45.00mm)
Length	2.500" (63.50mm)
Series	HSE
Package	Box
Diameter	-
Material	Aluminum Alloy
Fin Height	0.500" (12.70mm)
Package Cooled	TO-220
Product Status	Active
Material Finish	Black Anodized
Attachment Method	Bolt On and PC Pin
Base Product Number	HSE-B635
Thermal Resistance @ Natural	6.41°C/W
Power Dissipation @ Temperature Rise	11.7W @ 75°C
Thermal Resistance @ Forced Air Flow	3.53°C/W @ 200 LFM