In the fierce competition in the semiconductor industry, Taiwan's TSMC has once again become the focus of the market. With the rapid development of AI technology, the demand for more powerful computing continues to rise, and the price increase and expansion of TSMC's 3-nanometer foundry and advanced packaging technology has become a new hot spot in the market.

First of all, TSMC 3 nano foundry prices are expected to increase by more than 5%, which is behind the market situation of short supply. Seven customers, such as Apple and Nvidia, have fully captured TSMC's 3-nanometer production capacity, and orders are expected to reach 2026. This price increase not only reflects TSMC's leading position in the high-end process field, but also indicates that the high-end competition in the semiconductor market will be more intense in the future.

At the same time, TSMC's advanced packaging technology has also ushered in new development opportunities. According to supply chain news, TSMC Zhunan Advanced Packaging Plant (AP6) has become the largest CoWoS (Chip-on-Wafer-on-Substrate) base in Taiwan, with a monthly production capacity expected to increase from 17,000 to 33,000 pieces. With the launch of the AI hundred trillion training model, the demand for AI accelerator hardware continues to rise, and the shortage of advanced packaging capacity is becoming more and more obvious. Nvidia, AMD and other major customers have shown a strong interest in TSMC advanced packaging technology, and Nvidia has adopted a strategy of price increase and profit reduction to ensure its leading position in the market.

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