In the field of semiconductor manufacturing, the evolution of lithography technology is a key force driving the continuous development of chip processes. At present, ASML is a leader in the lithography machine market, and its LOW NA EUV (Low Numerical Aperture Extreme Ultraviolet) lithography machine has become a star product widely used in the industry. This lithography machine is favored for its low numerical aperture (NA=0.33) and relatively low cost (about 150 million euros), mainly for the manufacture of chips in processes of 7nm and below.

However, with the continuous progress of chip technology, the limits of LOW NA EUV lithography gradually appear. Although ASML claims that it can support the 2nm process and reach the limit of 1.4nm mass production with multiple exposure technology, to explore further, it will need to move to High NA EUV lithography. This lithography machine has a higher numerical aperture (NA=0.55), is capable of printing finer linewidths, and supports mass production up to 1nm processes. If combined with multiple exposure technology, it can even meet the requirements of the 5 ammeter (0.5nm) process in mass production by 2033.

However, the evolution of technology has not been smooth. ASML has planned the next generation of Hyper NA EUV lithography (NA=0.75), known in the industry as a "super" lithography machine, whose potential manufacturing capabilities will touch process nodes below 2 emm (0.2nm). However, by ASML's own admission, there are many technical challenges that need to be overcome to achieve this technical goal, which may take up to 10 years, and may never be overcome.

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