Apple's ambitions in the field of AI have added a new chapter, according to the latest reports, its upcoming M5 series of chips will be built by TSMC using the most advanced SoIC-X packaging technology, specifically tailored for artificial intelligence servers. This news not only reveals Apple's deep cooperation strategy in the field of high-end chip manufacturing, but also indicates that the AI server market is about to usher in a double leap in performance and efficiency.

Apple's persistent pursuit of self-developed chips has set a benchmark in the global technology world. From MacBook to iPad, M-series chips continue to refresh industry standards with their excellent performance and energy efficiency ratio, demonstrating Apple's deep heritage in the field of chip design. Today, Apple extends this advantage to the field of AI servers, and the birth of the M5 chip is undoubtedly another important milestone in Apple's AI technology layout.

As a leader in the semiconductor industry, TSMC's SoIC-X chip stacking technology is the focus of attention in the industry. The technology achieves efficient interconnection and integration between chips through innovative packaging methods, providing unprecedented performance improvements and power optimization for AI servers. Apple's choice of TSMC as a foundry for the M5 chip is undoubtedly a high recognition of its technical strength and innovation ability.

Morgan Stanley's prediction further confirms Apple's firm belief in the future of AI. In the second half of next year, with the mass production of the M5 chip, the AI server market will usher in a performance revolution led by Apple. This will not only promote TSMC's large-scale expansion in SoIC production capacity, but also stimulate the innovation vitality of the entire semiconductor industry chain, and jointly promote the rapid development and application of AI technology.

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