Intel is taking delivery of ASML's second €350 million (approximately $383 million) new High NA EUV equipment. According to a transcript of Intel's 8/1 earnings call, CEO Pat Gelsinger said Intel began receiving its first large equipment in December, which will take months to install and is expected to lead to a new generation of more powerful computers.
​
Gelsinger noted on the call that a second High NA unit is coming to the facility in Oregon.
​
The comment went unnoticed because Intel's stock price did not perform well after its earnings call.
​
ASML executives said in July that the company had begun shipping a second High NA device to an unnamed customer and would only record revenue from the first one this year. Still, there are some questions about when customers will adopt.
​
ASML has received orders for more than a dozen High NA machines from customers including TSMC, Samsung, Intel, Micron and SK Hynix. Intel plans to have the technology in mass production by 2027, and TSMC will receive the device this year, but has not said when it will go into production.
​
ASML CEO Christophe Fouquet said on July 17 that DRAM memory manufacturers, which could mean Samsung, SK Hynix or Micron, could start using High NA devices in 2025 or 2026.

(Note: The article comes from the network, the information is for reference only, does not represent the views of this website, if there is infringement, please contact to delete!)