On August 6, 2024, SK Hynix announced that the company and the U.S. Department of Commerce have signed a non-binding Preliminary Memorandum of Terms (PMT) for SK Hynix's investment ina semiconductor advanced packaging facility in Indiana, USA. Based on the CHIPS and Science Act, it will receive direct grants of up to $450 million and loans of up to $500 million. At the same time, the U.S. Treasury Department decided to provide SK Hynix with a tax credit of up to 25 percent on investments in the United States.

SK Hynix is deeply grateful for the support of the US government, and will do its best to carry out the subsequent relevant processes until the subsidy is finalized.

In the meantime, SK Hynix is planning to build a factory in Indiana to smoothly start mass production of AI-oriented storage devices. The company looks forward to contributing to the development of the global semiconductor supply chain.

SK Hynix announced in April this year that it will invest $3.87 billion to build an advanced packaging plant in Indiana, creating about 1,000 jobs, and will also work with local research institutions such as Purdue University to conduct semiconductor research and development.

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