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SK Hynix and the U.S. Department of Commerce signed a preliminary memorandum of Understanding for an Advanced packaging plant in Indiana

On August 6, 2024, SK Hynix announced that the company and the U.S. Department of Commerce have signed a non-binding Preliminary Memorandum of Terms (PMT) for SK Hynix's investment ina semiconductor advanced packaging facility in Indiana, USA. Based on the CHIPS and Science Act, it will receive direct grants of up to $450 million and loans of up to $500 million. At the same time, the U.S. Treasury Department decided to provide SK Hynix with a tax credit of up to 25 percent on investments in the United State....
2024-08-10 11:17:22
SK Hynix and the U.S. Department of Commerce signed a preliminary memorandum of Understanding for an Advanced packaging plant in Indiana

Nvidia will push the Blackwell Ultra and B200A in 2025, and will increase the proportion of HBM3e 12hi consumption to 40% | TrendForce Consulting

TrendForce Consulting: Nvidia will push Blackwell Ultra and B200A in 2025, which will pull up the proportion of HBM3e 12hi consumption to 40% According to the latest HBM report from TrendForce Consulting, with the iteration of AI chips, the HBM (high bandwidth memory) capacity of a single chip has also increased significantly. NVIDIA is currently the largest buyer in the HBM market, and it is expected that after the launch of products such as Blackwell Ultra and B200A in 2025, its purchase share in the HBM ....
2024-08-10 11:17:15
Nvidia will push the Blackwell Ultra and B200A in 2025, and will increase the proportion of HBM3e 12hi consumption to 40% | TrendForce Consulting

Intel announces the successful lighting of the 18A product

On August 7, Intel announced that the first products based on the Intel 18A process node - AI PC client processor Panther Lake and server processor Clearwater Forest - have been shipped, powered on and successfully started the operating system, less than two quarters away from the stream. According to Intel, both Panther Lake and Clearwater Forest are progressing well and are expected to begin mass production in 2025. In addition, Intel also announced that the first external customer with Intel 18A is expec....
2024-08-09 11:12:11
Intel announces the successful lighting of the 18A product

Infineon: World's largest 8-inch silicon carbide fab starts

On August 8, power semiconductor giant Infineon announced that it has officially launched the first phase of a new fab in Malaysia, which will be the world's largest and most competitive 200 mm (8 inch) silicon carbide (SiC) power semiconductor fab, with mass production expected to begin in 2025. The first phase of the fab, with an investment of €2 billion, will focus on silicon carbide and will also include gallium nitride (GaN) epitaxy; The second phase, with an investment of up to €5 billion, w....
2024-08-09 11:05:58
Infineon: World's largest 8-inch silicon carbide fab starts

ASML's second High-NA device is coming to Intel's Oregon facility

Intel is taking delivery of ASML's second €350 million (approximately $383 million) new High NA EUV equipment. According to a transcript of Intel's 8/1 earnings call, CEO Pat Gelsinger said Intel began receiving its first large equipment in December, which will take months to install and is expected to lead to a new generation of more powerful computers.​Gelsinger noted on the call that a second High NA unit is coming to the facility in Oregon.​The comment went unnoticed because Intel's stock price did....
2024-08-07 11:08:23
ASML's second High-NA device is coming to Intel's Oregon facility

Jcet announces partnership with gallium nitride gate driver head manufacturer

On August 2, JDC announced that it has entered into a strategic partnership with Allegro MicroSystems, a manufacturer of magnetic sensor ics and power ics, to further enhance the stability and efficiency of the supply chain and better serve the needs of Chinese customers.​In response to the cooperation, Changdian Technology said that the two sides will focus on establishing local packaging and testing capabilities for high-precision magnetic sensors and power management solutions, and related products can b....
2024-08-06 16:56:59
Jcet announces partnership with gallium nitride gate driver head manufacturer

Storage giant announces mass production of 12nm LPDDR5X DRAM package

South Korean memory giant Samsung has announced the start of mass production of the world's thinnest 12-nanometer LPDDR5X DRAM package, consolidating its leadership position in the low-power DRAM market. Four layers stack, each layer stack two layers structure, there are 12GB and 16GB two capacities.​Samsung said it uses its chip packaging expertise to offer ultra-thin LPDDR5X DRAM packages to allow more space for mobile devices and improve heat dissipation. Support for simpler thermal control is increasing....
2024-08-06 16:46:47
Storage giant announces mass production of 12nm LPDDR5X DRAM package

What is MLCC? MLCC Introduction！

Definition: Multi-layer Ceramic Capacitors, composed of sintered ceramic dielectric diaphragms as internal electrodes and metal materials as external electrodes, can effectively regulate the flow of current in the circuit and prevent electromagnetic interference between components, and are the most used chip capacitors in electronic devices.​According to the different sizes, MLCC can be divided into different specifications, named in the way of L×W (length × width), such as 0402, 0603, 0505, 080....
2024-08-06 16:00:47
What is MLCC? MLCC Introduction！

Tesla 4680 battery technology innovation, leading the new era

In the fierce competition in the electric vehicle industry, Tesla has always led every major change in the industry with its forward-looking technical vision and unremitting spirit of innovation. Recently, Tesla CEO Elon Musk's clear instructions to the 4680 battery research and development team once again highlighted Tesla's ambitions in the field of battery technology, indicating that electric vehicles are about to usher in a technological revolution driven by cost optimization and safety upgrades. In the....
2024-07-19 11:27:45
Tesla 4680 battery technology innovation, leading the new era

Texas Instruments: 80,000 + Analog IC and embedded processor innovation revolution

In today's era of rapid technological change, the chip, as the cornerstone of the electronic industry chain, is promoting the change of all walks of life at an unprecedented speed. At the 2024 Shanghai Electronics Show in Munich, Texas Instruments (TI), the world's leading semiconductor design and manufacturing company, showcased its deep strength and innovation in automotive electronics, robotics and energy infrastructure with its vast 80,000+ analog IC and embedded processor product line. Once again prove....
2024-07-19 11:22:14
Texas Instruments: 80,000 + Analog IC and embedded processor innovation revolution

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